| 1. | Calibration and use of torque meters used in packaging applications
包装用扭矩计校正及使用方法 |
| 2. | Systems , including existing crm and erp packaged applications , and
系统，包含现有的crm和erp打包应用程序，以及 |
| 3. | Specifies the platform that the packaged application or component is targeting
指定打包的应用程序或组件的目标平台。 |
| 4. | Specification for low - density polyethylene films for general use and packaging applications
通用和包装用低密度聚乙烯膜规范 |
| 5. | The lsb does not specify the tool to install these rpm - packaged applications
Lsb没有指定安装这些打包成rpm的应用程序的工具。 |
| 6. | Intranet - style applications match the classic packaged application software model
企业内联网式的应用程序符合经典的封装式应用程序软件模型。 |
| 7. | Standard specification for polyethylene films made from low - density polyethylene for general use and packaging applications
通用和包装用低密度聚乙烯薄膜标准规范 |
| 8. | An introduction to eutectic au sn solder alloy and its preforms in microelectronics optoelectronic packaging applications
金锡焊料及其在电子器件封装领域中的应用 |
| 9. | The esb is required to manage the interactions with backend packaged applications , such as siebel and sap
需要esb来管理同后端封装的应用程序的交互，比如siebel和sap 。 |
| 10. | Pb - free solders ? sn - bi - zn based with our own patent and their modification to fit for package applications
无铅焊锡?锡铋锌系无铅焊锡，材料设计、开发，焊料（锡球、锡膏）开发等。 |
